Brazing Rod Copper to Copper Round 1% AG

Phosphorus-Containing, Low-Melting Hard Solder

This phosphorus-containing, low-melting hard solder is known for its excellent flow properties, making it ideal for joining copper with copper or copper-based materials. Key features and specifications include:

Features and Applications

• Material Compatibility:

  • Suitable for copper and copper-based materials.
  • Not suitable for steels (Fe) and nickel alloys due to brittle phase formation.
  • Not recommended for use in sulphurous media.

• Usage in Various Industries:

  • Installation technology
  • Electronics industry
  • Refrigeration and air conditioning technology
  • Effective in refrigeration industry applications down to -50°C.
  • Suitable for flame soldering, induction heating, and protective gas furnaces.

Technical Specifications

• Standards:

  • ISO 17672 (CuP 179)
  • DIN EN 1044 (CP 203)
  • DVGW worksheets GW 2 and GW 7
  • Certified with DVGW test mark (DW-0105CL0476) and the quality mark of Gütegemeinschaft Kupferrohr eV.

• Composition:

  • Copper (Cu): Balance
  • Phosphorus (P): 6.2%
  • Permissible Contamination (max. % by weight):
    • Aluminum (Al): 0.01%
    • Bismuth (Bi): 0.030%
    • Cadmium (Cd): 0.01%
    • Lead (Pb): 0.025%
    • Zinc (Zn): 0.05%
    • Combined Zn + Cd: 0.05%
  • Total Contamination (max. % by weight): 0.25%

• Physical Properties:

  • Melting Range: 710-890°C
  • Working Temperature: 760°C
  • Density: 8.1 g/cm³
  • Tensile Strength (DIN EN 12797): 250 MPa for Cu
  • Strain: 5%
  • Operating Temperature of the Solder Joint: Max. 150°C (without loss of strength)